Simulation model for packaging time optimation using Lean Manufacturing

Yakeline Sheila Galvan-Nina, Alexandra Chuquillanqui-Mantari, Jhon Rodrigo Ortiz-Zacarias, Iraiz Lucero Quintanilla-Mosquera, Sliver Ivan Del Carpio-Ramirez, Nabilt Moggiano

Producción científica: Libro o Capítulo del libro Contribución a la conferenciarevisión exhaustiva

6 Citas (Scopus)

Resumen

Today, the consumption of wheat flour in Peru is 2 million tonnes per year, but the country does not produce enough wheat for this demand, therefore, imports cover around 92% of this requirement, the main suppliers being Canada, the United States and Argentina. All this indicates that the flour industry will continue to grow, as is the case of the company GRUPO INGENIA-T, one of the few successful Peruvian industries of milling, dosing and packaging of wheat and other raw materials for consumption. However, when monitoring and analysing the manufacturing conditions and total process flows, production problems were detected and simulated in the Anylogic software where the Lean Manufacturing methodology was applied to remedy the bottleneck, giving us the working time of the staff, which is 8 hours and 10 minutes. Then, the present study aims to implement a simulated model to optimise production times in accordance with the criteria and requirements offered by the Theory of Constraints, which is why it was essential to establish a flow diagram of the industry's processes. Finally, we have as a result that the production of 70 bags well packed and sealed was given in a time of 1 to 2 seconds for the inspection and cleaning of the same, without the coupling of the proposed system would not be possible to reach such a quantity because the people in charge of this procedure need to rest because the work they do is done manually, therefore, we conclude that the machine complies with reducing time and increasing production.

Idioma originalInglés estadounidense
Título de la publicación alojada2022 IEEE 13th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2022
EditoresSatyajit Chakrabarti, Rajashree Paul
EditorialInstitute of Electrical and Electronics Engineers Inc.
Páginas655-660
-6
ISBN (versión digital)9781665492997
DOI
EstadoIndizado - 2022
Evento13th IEEE Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2022 - Virtual, Online, Estados Unidos
Duración: 26 oct. 202229 oct. 2022

Serie de la publicación

Nombre2022 IEEE 13th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2022

Conferencia

Conferencia13th IEEE Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2022
País/TerritorioEstados Unidos
CiudadVirtual, Online
Período26/10/2229/10/22

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Publisher Copyright:
© 2022 IEEE.

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