The traditional construction of masonry structures in Peru is in great demand, but it uses excessive amounts of human resources, time and materials; everything would indicate that this method is currently very deficient. The purpose of this research is to design automated machines with the capacity to assemble bricks in the construction of load-bearing walls in houses, where engineering software such as Autodesk Inventor was used. In addition, the simulation of displacement in brick laying was performed using BIM tools, which consists of 3D modeling based on images that contain all the necessary information for the assembly of the bricks. This is exported to the Matlab program for the coordinates of each wall, in order to simulate the trajectory and location of the work area for the machines. Finally, greater precision was obtained in the movements of the robotic arm using the BIM methodology, obtaining information for the path of the construction by means of its length or the name of the wall. In addition, it allows optimizing time, since it only performs one displacement compared to the traditional way. With this research it will be possible to build load-bearing walls in less time, complying with Peruvian construction regulations, avoiding contamination due to excess of materials, and having a better use of resources.
|Idioma original||Inglés estadounidense|
|Título de la publicación alojada||2023 IEEE 13th Annual Computing and Communication Workshop and Conference, CCWC 2023|
|Editorial||Institute of Electrical and Electronics Engineers Inc.|
|ISBN (versión digital)||9798350332865|
|Estado||Indizado - 2023|
|Evento||13th IEEE Annual Computing and Communication Workshop and Conference, CCWC 2023 - Virtual, Online, Estados Unidos|
Duración: 8 mar. 2023 → 11 mar. 2023
Serie de la publicación
|Nombre||2023 IEEE 13th Annual Computing and Communication Workshop and Conference, CCWC 2023|
|Conferencia||13th IEEE Annual Computing and Communication Workshop and Conference, CCWC 2023|
|Período||8/03/23 → 11/03/23|
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© 2023 IEEE.