Mechatronic design and monitoring of a tuned mass damper in structural vibrations

Jose Luis Nizama-Mallqui, Evelin Ruth Mayta-Mercado, Ivan Enrique Sarmiento-Naupa, Albert Jorddy Valenzuela-Inga, Juan Gabriel Benito-Zuniga, Lizbett N. Mantari-Ramos, Giovene Perez-Campomanes

Producción científica: Libro o Capítulo del libro Contribución a la conferenciarevisión exhaustiva

2 Citas (Scopus)

Resumen

The implementation of passive systems is gaining relevance due to the seismic vulnerability of high-rise buildings in several countries around the world, since they help structures to dissipate external loads, providing stiffness and damping against dynamic earthquake loads. This research aims to improve the dynamic response of the structure by implementing the tuned mass damper (TMD) for 10, 15 and 30-story buildings through engineering software and simulations with a MPU 6050 Gyroscope sensor, to obtain the seismic acceleration over time. An improvement of the inelastic drift in the X direction of up to 22.78% was obtained in the 15-story building, for the basal shear in the X direction was improved by 17.49% in the 10-story building and an improvement of the fundamental period of up to 10.55% in the 30-story building. Finally, the incorporation of the TMD as a seismic dissipator for a passive lateral displacement control system could show the reduction of the inelastic drifts of each floor and basal shear in the buildings, seeking to generate earthquake protection to reduce the damaging impacts produced by the presence of the earthquake, being more favorable for mid-rise buildings; likewise, the gyroscopic sensor yielded efficient results of electronic and mechanical design since the signals received showed that the mid-rise buildings reflect a more stable behavior.

Idioma originalInglés estadounidense
Título de la publicación alojada2023 IEEE 13th Annual Computing and Communication Workshop and Conference, CCWC 2023
EditoresRajashree Paul
EditorialInstitute of Electrical and Electronics Engineers Inc.
Páginas1326-1332
-7
ISBN (versión digital)9798350332865
DOI
EstadoIndizado - 2023
Evento13th IEEE Annual Computing and Communication Workshop and Conference, CCWC 2023 - Virtual, Online, Estados Unidos
Duración: 8 mar. 202311 mar. 2023

Serie de la publicación

Nombre2023 IEEE 13th Annual Computing and Communication Workshop and Conference, CCWC 2023

Conferencia

Conferencia13th IEEE Annual Computing and Communication Workshop and Conference, CCWC 2023
País/TerritorioEstados Unidos
CiudadVirtual, Online
Período8/03/2311/03/23

Nota bibliográfica

Funding Information:
Thanks to the conference for seeking out new impactful research, to the IEEE templates that help us summarise manuscripts, and to Continental University for mentoring the faculty.

Publisher Copyright:
© 2023 IEEE.

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