Lower Limb Exoskeletons and Virtual Reality for Rehabilitation: A Technological Review

Deyby Huamanchahua, Josue Abad, Rodrigo Aique, Christoffer Vasquez, Cristóbal Ruiz de Somocurcio, Adrián Sasieta

Producción científica: Libro o Capítulo del libro Contribución a la conferenciarevisión exhaustiva

Resumen

Over time, individuals may face mobility issues in specific body parts, especially the lower limbs, due to accidents or other circumstances. However, the rapid evolution of technology has introduced robotic devices such as exoskeletons and virtual reality for patient rehabilitation. This article systematically reviews research on exoskeletons and virtual reality for lower limb motor rehabilitation. The objective is to create a comprehensive table of relevant information and enhance future researchers' ability to communicate effectively on this topic. Using the Prisma methodology, 27 investigations were meticulously selected from multiple databases. The findings highlight diverse exoskeletons contributing to lower limb rehabilitation while recognizing areas requiring further improvements, such as virtual reality utilization.

Idioma originalInglés estadounidense
Título de la publicación alojada2023 15th IEEE International Conference on Industry Applications, INDUSCON 2023 - Proceedings
EditoresAlexandre Acacio de Andrade, Marcos de Sales Guerra Tsuzuki, Marcosiris Amorim de Oliveira Pessoa
EditorialInstitute of Electrical and Electronics Engineers Inc.
Páginas1678-1684
-7
ISBN (versión digital)9798350314182
DOI
EstadoIndizado - 2023
Publicado de forma externa
Evento15th IEEE International Conference on Industry Applications, INDUSCON 2023 - Sao Bernardo do Campo, Brasil
Duración: 22 nov. 202324 nov. 2023

Serie de la publicación

Nombre2023 15th IEEE International Conference on Industry Applications, INDUSCON 2023 - Proceedings

Conferencia

Conferencia15th IEEE International Conference on Industry Applications, INDUSCON 2023
País/TerritorioBrasil
CiudadSao Bernardo do Campo
Período22/11/2324/11/23

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Publisher Copyright:
©2023 IEEE.

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