Resumen
This study analyzes the impact of continuous improvement plans on student outcomes in the Environmental Engineering program at Continental University during the 2017–2023 period. Through a documentary review of continuous improvement plans and student outcome reports, actions aimed at strengthening hard skills (engineering technical knowledge, experimentation, design, problem-solving, and use of modern tools) and actions to strengthen soft skills (communication, teamwork, ethics, leadership, professional responsibility, and lifelong learning) were identified. The results show a positive correlation between the improvement actions and sustained increases over time in student outcomes, especially in the most frequently addressed competencies such as design, experimentation, and problem analysis. This analysis allows us to conclude that the systematic implementation of actions aligned with enhancing student outcomes has significantly contributed to strengthening the graduate profile, consolidating an institutional culture of continuous improvement.
| Idioma original | Inglés estadounidense |
|---|---|
| Título de la publicación alojada | ICACIT 2025 - Proceedings |
| Subtítulo de la publicación alojada | 11th International Symposium on Accreditation of Engineering and Computing Education |
| Editorial | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (versión digital) | 9798331557973 |
| DOI | |
| Estado | Indizado - 2025 |
| Evento | 11th International Symposium on Accreditation of Engineering and Computing Education, ICACIT 2025 - Chiclayo, Perú Duración: 15 oct. 2025 → 17 oct. 2025 |
Serie de la publicación
| Nombre | ICACIT 2025 - Proceedings: 11th International Symposium on Accreditation of Engineering and Computing Education |
|---|
Conferencia
| Conferencia | 11th International Symposium on Accreditation of Engineering and Computing Education, ICACIT 2025 |
|---|---|
| País/Territorio | Perú |
| Ciudad | Chiclayo |
| Período | 15/10/25 → 17/10/25 |
Nota bibliográfica
Publisher Copyright:©2025 IEEE.
Huella
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