Design of a Machine to Reduce Shrinkage and Cracking in the Rice Hulling Process

Krhistians Enrique Chavez Cardenas, Sario Angel Chamorro Quijano, Cleo Alex Alarcon Vasquez, Rafael De La Cruz Casano

Producción científica: Libro o Capítulo del libro Contribución a la conferenciarevisión exhaustiva

Resumen

This study presents the design of an automatic machine for rice husking processing, including 3 fundamental domains: mechanical, electronic and control, in order to reduce shrinkage, cracking and improve product quality. The development of the research contemplates the optimization and automation of 3 domains in the husking process, in order to allow a faster processing and a good quality of the product. The design has as initial part the entry of the grain, then it is sensed and guided through a channel, until it reaches the rollers, then the hulls are peeled by the movement of the rollers, it is guided through a channel to be sucked and finally a quality product is dispensed. The design is validated by previous studies and with CAD design, mechanical and electronic software, concluding a significant improvement of the product, where the clearance is 0.8 mm, allowing the grain not to be cracked and to peel in an optimal way.

Idioma originalInglés estadounidense
Título de la publicación alojada2023 IEEE 14th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2023
EditoresSatyajit Chakrabarti, Rajashree Paul
EditorialInstitute of Electrical and Electronics Engineers Inc.
Páginas778-782
-5
ISBN (versión digital)9798350304138
DOI
EstadoIndizado - 2023
Evento14th IEEE Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2023 - New York, Estados Unidos
Duración: 12 oct. 202314 oct. 2023

Serie de la publicación

Nombre2023 IEEE 14th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2023

Conferencia

Conferencia14th IEEE Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2023
País/TerritorioEstados Unidos
CiudadNew York
Período12/10/2314/10/23

Nota bibliográfica

Publisher Copyright:
© 2023 IEEE.

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